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Hybrid Laminate Board6L
Hybrid Laminate Board6L
▪ Number of layers: 6 layers▪ Process: Immersion gold plating▪ Aspect ratio: 8:1▪ Finished product thickness: 1.6mm▪ Minimum hole diameter: 0.2mm▪ Line width/line spacing: 5mil/5mil▪ Technical point: FR4+Rogers 4350B hybrid pressing
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5 oz Power Board12L
5 oz Power Board12L
▪ Plate material: S1000-2m▪ Plate thickness: 4.5mm▪ Number of layers: 12 layers▪ Finished copper thickness: 4OZ for the inner layer, 5OZ for the outer layer▪ Smallest copper hole: 30um▪ Surface process: Immersion gold plating
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Rigid-Flex PCB6L
Rigid-Flex PCB6L
▪ Number of layers: 6 layers for hard board, 2 layers for soft board▪ Material: FR4+PI▪ Aspect ratio: 8:1▪ Finished product thickness: 1.6mm + 0.15mm▪ Minimum hole diameter: 0.2mm▪ Line width/line spacing: 4mil/4mil▪ Technical points:
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10l Half-Hole Board10L
10l Half-Hole Board10L
.Layers: 10 Layers.Material: Shengyi S1000-2M.Aspect Ratio: 8:1.Finished Thickness: 1.6mm.Minimum Hole Diameter: 0.2mm.Line Width/Spacing: 3mil/3mil.Surface Finish: ENIG (Electroless Nickel Immersion Gold).Technical Highlights: Half-hole, Minimum BGA Pitch 0.2mm
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RF4L 1+2+1
RF4L 1+2+1
◆ Structure: 4L，1+2+1，Total thickness:180μm min;◆ Layer alignment: blind via ring width 25μm，Adjacentlayer shift≤25μm，Random layer shift≤40μm◆ MSAP process，trace width tolerance ±5μm ;◆ Surface finish: Thin ENEPIG ( Ni thickness 0.3~0.5μm)
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AP/FCCSP6L 2+2+2
AP/FCCSP6L 2+2+2
◆ Structure : 6L, 2+2+2,Total thickness 400 μm, core thickness 150μm;Inner layer: 75μm laser dirlled“X” hole ,copper filled. Outer layer:60μmlaser blind via.◆ Fine line: inner layerMSAP process,L/S=15/15 μm.◆ AUS SR1/thickness 15+/-7μm，SRO=105μm，SM shift tolerance≤15...
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SSD2L
SSD2L
◆ Structure: 2L，Total thickness:100 μm min;Mechanical Drilling，Filled Via with SM;Laser Drilling，Filled Via with Copper, dimple≤5μm;◆ Tenting process，L/S≥35/35um;MSAP process,L/S≤25/25μm;◆ SM colour: Green or Black matte /thickness 20+/-7μm,SM Flatness≤7μm;◆ Surface fini...
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High-level HDI board12L
High-level HDI board12L
▪ Product Name: 12-Layer 3-Level HDI Board▪ Number of layers: 12 layers▪ Material: TU872▪ Aspect ratio: 6:1▪ Finished product thickness: 1.2mm▪ Minimum hole diameter: laser hole 0.1mm, mechanical hole 0.2mm▪ Line width/line spacing: 2.6mil/2.6mil▪ Technical points: 3+N+3,...
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High-level HDI board12L
High-level HDI board12L
▪ Layers:12L ▪ Board thickness:0.8mm ▪ Material:EM-370 ▪ Min Width/Spacing:60/60um ▪ Surface treament:ENIG+OSP
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High-level HDI board8L
High-level HDI board8L
▪ Number of layers: 8 layers▪ Material: S1000-2▪ Aspect ratio: 8:1▪ Finished product thickness: 1.2mm▪ Minimum hole diameter: laser hole 0.1mm, mechanical hole 0.15mm▪ Line width/line spacing: 3mil/4mil▪ Technical points: 2+N+2, through-hole plate with holes, minimum BGA d...
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High-level HDI board16L
High-level HDI board16L
▪ Layers -- 16Layer ▪ Material -- PanasonicR-5775 ▪ Thickness --2mm ▪ Inner copper -- HOZ ▪ Min line width/spacing -- 2/2mil ▪ Min Aperture --0.1mm ▪ Surface Treament- ENIG ▪ Application --Communication Equipmet
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High-level HDI board24l
High-level HDI board24l
▪ Number of layers: 24L▪ Material: FR-4 (Tg180) VT-47▪ Plate thickness: 2.59+/-0.26mm▪ Minimum line width/line spacing: 3.5/5.0 mil▪ Minimum hole diameter: 0.25mm▪ Surface treatment: Immersion gold plating
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