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High-Multilayer Board10L
High-Multilayer Board10L
▪ Number of layers: 10L▪ Product Model: 400Gbps QSFP-DD▪ Material: M6(R-5775)▪ Thickness tolerance of finished product: Gold finger area 1.0 ± 0.075mm▪ Plug shape tolerance: ±0.05mm▪ Hole filling depression: <15μm▪ Surface treatment: Immersion nickel-palladium gold + el...
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High-Multilayer Board34L
High-Multilayer Board34L
▪ Number of layers: 34L▪ Material: FR408HR ▪ Board thickness: 4.0mm ▪ Copper thickness of inner and outer layers: 10Z ▪ Surface treatment: ENIG
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High-Multilayer Board26L
High-Multilayer Board26L
▪ Number of layers: 26 layers▪ Material: Tachyon 100G▪ Thickness: 3.5 ± 0.35 mm▪ Inner copper thickness: 0.330Z▪ Minimum line width/line spacing: 0.112/0.05 millimeters▪ Minimum aperture: 0.225 mm▪ Surface treatment: immersion gold plating▪ Application field: Switch
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Heavy Copper Board10L
Heavy Copper Board10L
▪ Number of layers - 10L▪ Material - TU865▪ Plate thickness - 3.5mm▪ Copper thickness of inner and outer layers - 5OZ▪ Minimum line width/line spacing - 2/2mm▪ Minimum hole diameter - 0.7mm▪ Surface treatment - immersion gold ▪ Application field - communication equipment
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Heavy Copper Board10L
Heavy Copper Board10L
▪ Industrial control system ▪ Number of layers - 10L▪ Material - EM-370(Z)▪ Plate thickness - 2.48mm▪ Copper thickness of inner and outer layers - 4 oz (RTF)▪ Minimum line width/line spacing - 0.433/0.137mm▪ Minimum hole diameter - 0.3mm▪ Surface treatment - immersion gol...
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Heavy Copper Board10L
Heavy Copper Board10L
▪ Number of layers - 10L▪ Material - EM-827▪ Plate thickness - 4.85mm▪ Copper thickness of inner and outer layers - 3 oz▪ Minimum line width/line spacing - 0.45/0.30mm▪ Minimum hole diameter - 0.25mm▪ Surface treatment - immersion gold plating
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Rigid-Flex PCB8L
Rigid-Flex PCB8L
▪ Layer count--8L▪ Material --High TG FR-4+PI▪ Board thickness --1.0±0.1mm▪ Min.LW/LS--0.10/0.10mm▪ Min.Drill Size --0.1mm▪ Surface Finish--ENIG
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Rigid-Flex PCB14L
Rigid-Flex PCB14L
▪ Layer count--14L▪ Material --High TG FR-4+Flex▪ Board thickness--1.6±0.16mm▪ Min.LW/LS--0.10/0.10mm▪ Min.Drill Size --0.15mm▪ Surface Finish--ENIG
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5G High-Speed Products22L
5G High-Speed Products22L
▪ 22 Layer PCB▪ High Speed Low Loss▪ 2 Lam-L22-3 and L1-22▪ 11 Sets of Back Drill,VIPPO▪ 20 T-Coins 22-3/3-1▪ 10 set of CI Single/Diff▪ HVLP Copper
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LED Substrate AIO2L
LED Substrate AIO2L
▪ Layer--2L▪ Material --Al2O3▪ Thickness --1.2mm▪ Copper --35um▪ Finishing --ENEPIG
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High Speed PCB26L
High Speed PCB26L
▪ Layer count-26L▪ Material -Tachyon 100G▪ Board Thickness --3.5±0.35mm▪ Copper thickness --0.33OZ▪ Min.LW/LS-0.118/0.051mm.Min▪ hole Size --0.225mm▪ Surface Finish --ENIG▪ Application field-Industrial Control
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3W LED Aluminum1L
3W LED Aluminum1L
▪ Layer--1L▪ Material --VT4B9▪ Thickness --1.524mm▪ Copper --140um▪ Finishing --LF-HASL
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